Brief Function Introduction:
The LAM ELECTROSTATIC CHUCK 839-800327-315 is a high-performance electrostatic chuck designed for semiconductor wafer processing. It ensures precise control over wafer position and pressure, facilitating efficient and accurate etching, deposition, and other critical fabrication processes.
Product Specifications:
Material Type: | High-strength, corrosion-resistant aluminum alloy |
Electrostatic Control: | Advanced electrostatic force regulation system |
Temperature Range: | -40°C to 150°C |
Vacuum Compatibility: | Up to 1 x 10^-6 Torr |
Dimension (WxDxH): | 315mm x 315mm x 50mm |
Max Load Capacity: | 15kg |
Product Details:
The LAM ELECTROSTATIC CHUCK 839-800327-315 is engineered to meet the demanding requirements of semiconductor manufacturing. Its advanced electrostatic force regulation system allows for unparalleled precision in wafer positioning and pressure control, ensuring optimal performance during various processing stages.
Crafted from a high-strength, corrosion-resistant aluminum alloy, this chuck is built to withstand the rigors of continuous use in cleanroom environments. Its ability to maintain precise control over wafer conditions across a wide temperature range (-40°C to 150°C) makes it suitable for a variety of processing conditions.
With exceptional vacuum compatibility, achieving ultra-high vacuum levels (up to 1 x 10^-6 Torr), this electrostatic chuck supports the most stringent vacuum processes required for semiconductor fabrication, including etching, deposition, and other critical steps.
The chuck's compact yet robust design measures 315mm x 315mm x 50mm, offering a versatile fit for a wide range of wafer sizes while ensuring easy integration into existing manufacturing setups.
Equipped with a maximum load capacity of 15kg, it can handle the weight of various wafer types and sizes without compromising stability or performance, making it an indispensable tool in the semiconductor industry.
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